Determining film stress from substrate shape using finite element procedures

A method for determining the stresses in a film applied to a substrate from measured substrate shape. The substrate is first analyzed using finite element techniques to obtain nodal forces at the surface of the substrate to which the film is applied, based on measured distortion data of the substrat...

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Bibliographic Details
Main Authors ENGELSTAD ROXANN L, LOVELL EDWARD G, FENG ZHAOHUA
Format Patent
LanguageEnglish
Published 15.06.2006
Subjects
INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES
MEASURING
MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE
PHYSICS
TESTING
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Summary:A method for determining the stresses in a film applied to a substrate from measured substrate shape. The substrate is first analyzed using finite element techniques to obtain nodal forces at the surface of the substrate to which the film is applied, based on measured distortion data of the substrate surface. The film is then analyzed to calculate the film stresses from the applied nodal forces using finite element techniques. The invention may be applied to determine stresses in thin films applied to a variety of substrates, including those used for micro-electronic (e.g., integrated circuit) and micro-mechanical devices and/or for the lithography masks or other optical/projection systems used to fabricate such devices.
Bibliography:Application Number: US20050245938