Stacked electronics for sensors

A stacked electronics module comprises a first layer including a first substrate having a front side and a backside, a first electrical interconnect layer disposed on the first substrate and a first electronic device disposed on the front side of the first substrate. In addition, the stacked electro...

Full description

Saved in:
Bibliographic Details
Main Authors FISHER RAYETTE A, BURDICK WILLIAM E.JR, ROSE JAMES W
Format Patent
LanguageEnglish
Published 08.06.2006
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:A stacked electronics module comprises a first layer including a first substrate having a front side and a backside, a first electrical interconnect layer disposed on the first substrate and a first electronic device disposed on the front side of the first substrate. In addition, the stacked electronics module comprises a second layer including a second substrate having a front side and a backside, a second electrical interconnect layer disposed on the second substrate and a second electronic device disposed on the front side of the second substrate.
Bibliography:Application Number: US20040003602