Resin compositions for press-cured mica tapes for high voltage insulation

Resin composition comprising an epoxy resin having an epoxide functionality of at least 2.5, a cycloaliphatic epoxy resin, a phenol-formaldehyde novolac and aluminum acetylacetonate. The resin is heat stable and is suitable for fabrication of resin-rich mica tapes having low reactivity at ambient te...

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Bibliographic Details
Main Authors IVERSEN ALAN M, MARKOVITZ MARK, NEWMAN WILLIAM G, YUNG MABEL S
Format Patent
LanguageEnglish
Published 01.06.2006
Subjects
BASIC ELECTRIC ELEMENTS
CABLES
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
CONDUCTORS
ELECTRICITY
INSULATORS
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
THEIR PREPARATION OR CHEMICAL WORKING-UP
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Summary:Resin composition comprising an epoxy resin having an epoxide functionality of at least 2.5, a cycloaliphatic epoxy resin, a phenol-formaldehyde novolac and aluminum acetylacetonate. The resin is heat stable and is suitable for fabrication of resin-rich mica tapes having low reactivity at ambient temperatures for good shelf life stability combined with high reactivity above 140° C. for application in press-cured tapes. The dissipation factors at room temperature to at least 200° C. are less than 3.0%.
Bibliography:Application Number: US20060332248