Edge plated printed wiring boards

Printed wiring board assemblies are described that include printed wiring boards having at least on thermally conductive plane. In addition, the printed wiring boards can also include edge plating on at least a portion of an edge of the printed wiring board. The printed wiring boards can also includ...

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Bibliographic Details
Main Authors MANGROLIA BHARAT M, ROY DON, VASOYA KALU K
Format Patent
LanguageEnglish
Published 18.05.2006
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:Printed wiring board assemblies are described that include printed wiring boards having at least on thermally conductive plane. In addition, the printed wiring boards can also include edge plating on at least a portion of an edge of the printed wiring board. The printed wiring boards can also include heat spreaders, heat sinks and/or thermally conductive heat paths to dissipate heat from the printed wiring board assembly. In many instances, the heat spreaders include microfoils. In one embodiment, the invention includes at least one circuit layer, at least one dielectric layer, at least one thermally conductive plane and edge plating that contacts the at least one thermally conductive plane.
Bibliography:Application Number: US20050211942