Semiconductor substrate, manufacturing method of a semiconductor device and testing method of a semiconductor device

A semiconductor substrate eliminates a restriction caused by a width of scribe lines so as to increase a number of semiconductor elements formed on the semiconductor substrate. A plurality of semiconductor element areas are formed by forming a plurality of unit exposed and printed areas, each of whi...

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Bibliographic Details
Main Authors FUJII SHIGERU, IZURU HITOSHI, MARUYAMA SHIGEYUKI, TASHIRO KAZUHIRO, ARISAKA YOSHIKAZU
Format Patent
LanguageEnglish
Published 11.05.2006
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor substrate eliminates a restriction caused by a width of scribe lines so as to increase a number of semiconductor elements formed on the semiconductor substrate. A plurality of semiconductor element areas are formed by forming a plurality of unit exposed and printed areas, each of which contains the semiconductor element areas. A first scribe line extends between the semiconductor element areas formed within the unit exposed and printed area. A second scribe line extends between the unit exposed and printed areas. A width of the first scribe line is different from a width of the second scribe line.
Bibliography:Application Number: US20050062488