Method for backside sealing organic light emitting diode (OLED) displays

A hermetically sealed glass package and method for manufacturing the hermetically sealed glass package are described herein. In one embodiment, the hermetically sealed glass package is suitable to protect thin film devices which are sensitive to the ambient environment. Some examples of such glass p...

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Bibliographic Details
Main Authors SCHROEDER JOSEPH F.III, BECKEN KEITH J, STRZEPEK HOLLY J, LOGUNOV STEPHAN L, REDDY KAMJULA P
Format Patent
LanguageEnglish
Published 20.04.2006
Subjects
ELECTRIC HEATING
ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
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Summary:A hermetically sealed glass package and method for manufacturing the hermetically sealed glass package are described herein. In one embodiment, the hermetically sealed glass package is suitable to protect thin film devices which are sensitive to the ambient environment. Some examples of such glass packages are organic emitting light diode (OLED) displays, sensors, and other optical devices. The present invention is demonstrated using an OLED display as an example.
Bibliography:Application Number: US20050095144