ASYMMETRIC SPATIAL LIGHT MODULATOR IN A PACKAGE

Disclosed herein is a micromirror package having a micromirror being attached to a supporting surface of a package substrate, and sealed between the package substrate and a package cover, whereas the micromirror array is placed offset the center of the supporting surface.

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Bibliographic Details
Main Authors	GRASSER REGIS, HUIBERS ANDREW
Format	Patent
Language	English
Published	20.04.2006
Subjects	GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PHYSICS TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS
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Summary:	Disclosed herein is a micromirror package having a micromirror being attached to a supporting surface of a package substrate, and sealed between the package substrate and a package cover, whereas the micromirror array is placed offset the center of the supporting surface.
Bibliography:	Application Number: US20040969300