Low melting-point solders, articles made thereby, and processes of making same

A composition includes a tin-containing solder with a melting temperature below about 150° C. The tin-containing solder includes indium, tin, and bismuth as alloy elements, and optionally contains a doping material and/or a second-phase dispersiod. A process includes blending the tin-containing sold...

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Bibliographic Details
Main Authors MARTIN EDWARD L, SUH DAEWOONG, BAETEN MELISSA A, BYRNE TIFFANY A
Format Patent
LanguageEnglish
Published 30.03.2006
Subjects
ALLOYS
CHEMISTRY
FERROUS OR NON-FERROUS ALLOYS
METALLURGY
TREATMENT OF ALLOYS OR NON-FERROUS METALS
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Summary:A composition includes a tin-containing solder with a melting temperature below about 150° C. The tin-containing solder includes indium, tin, and bismuth as alloy elements, and optionally contains a doping material and/or a second-phase dispersiod. A process includes blending the tin-containing solder under non-alloying conditions to achieve the discrete dispersion of the doping material. A process also includes blending the tin-containing solder with the particulate to achieve the discrete dispersion of the particulate. The composition is also combined with a microelectronic device to form a package. The composition is also combined with a microelectronic device and at least one I/O functionality to form a computing system.
Bibliography:Application Number: US20040954959