Method of forming a solder ball on a board and the board
In the method, a conductive pad of the board is etched to a depth that is greater than 50% and less than 100% of a thickness of the conductive pad. Subsequently, a solder ball may be formed on the etched conductive pad. For example, the conductive pad may be copper.
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Main Authors | , , , , , , |
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Format | Patent |
Language | English |
Published |
16.02.2006
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Subjects | |
Online Access | Get full text |
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Summary: | In the method, a conductive pad of the board is etched to a depth that is greater than 50% and less than 100% of a thickness of the conductive pad. Subsequently, a solder ball may be formed on the etched conductive pad. For example, the conductive pad may be copper. |
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Bibliography: | Application Number: US20050196243 |