Method of forming a solder ball on a board and the board

In the method, a conductive pad of the board is etched to a depth that is greater than 50% and less than 100% of a thickness of the conductive pad. Subsequently, a solder ball may be formed on the etched conductive pad. For example, the conductive pad may be copper.

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Bibliographic Details
Main Authors KIM BO-SEONG, CHOI HEE-GUK, KIM PYEONG-WAN, MOON HO-JEONG, AHN SANG-HO, KIM SEUNG-WOO, PARK TAE-SEONG
Format Patent
LanguageEnglish
Published 16.02.2006
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:In the method, a conductive pad of the board is etched to a depth that is greater than 50% and less than 100% of a thickness of the conductive pad. Subsequently, a solder ball may be formed on the etched conductive pad. For example, the conductive pad may be copper.
Bibliography:Application Number: US20050196243