Formation of a wire bond with enhanced pull

A method of forming a wire connection using a bonding tool is provided. A first bond is first formed from a bonding wire fed from the bonding tool at a first bonding point. The bonding wire is then extended from the first bond while moving the bonding tool from the first bonding point towards a seco...

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Bibliographic Details
Main Authors LEE WAI WAH, CHO CHIA YEN
Format Patent
LanguageEnglish
Published 19.01.2006
Subjects
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Summary:A method of forming a wire connection using a bonding tool is provided. A first bond is first formed from a bonding wire fed from the bonding tool at a first bonding point. The bonding wire is then extended from the first bond while moving the bonding tool from the first bonding point towards a second bonding point. Thereafter, the bonding wire is mechanically deformed by contacting the bonding tool against a support surface and the bonding tool is moved in a direction away from the first bond to pull the bonding wire before forming a second bond with the bonding tool.
Bibliography:Application Number: US20040891342