Electrical contacts in microelectromechanical devices with multiple substrates

Disclosed herein a microelectromechanical device having first and second substrates that are bonded together with a gap formed therebetween. A plurality of functional members is disposed within the gap. The two substrates are bonded with a bonding agent that comprises an electrically conductive adhe...

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Bibliographic Details
Main Authors RICHARDS PETER, DOAN JONATHAN, TARN TERRY, PATEL SATYADEV
Format Patent
LanguageEnglish
Published 15.12.2005
Edition7
Subjects
GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS
MICROSTRUCTURAL TECHNOLOGY
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PERFORMING OPERATIONS
PHYSICS
PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
TECHNICAL SUBJECTS COVERED BY FORMER USPC
TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS
TRANSPORTING
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Summary:Disclosed herein a microelectromechanical device having first and second substrates that are bonded together with a gap formed therebetween. A plurality of functional members is disposed within the gap. The two substrates are bonded with a bonding agent that comprises an electrically conductive adhesive material.
Bibliography:Application Number: US20050102082