Three-dimensional multichip stack electronic package structure

The present invention relates to a three-dimensional multichip stack electronic package structure and method for making the same, including a main substrate having at least a pin-hole set and at least a flexible substrate having at least a pin terminal. At least an electronic device including an act...

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Bibliographic Details
Main Authors HSU YUNG-YU, YUAN CHANG-AN, CHENG HSIENIE, CHIANG KUO-NING, LEE CHANGUN
Format Patent
LanguageEnglish
Published 13.10.2005
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The present invention relates to a three-dimensional multichip stack electronic package structure and method for making the same, including a main substrate having at least a pin-hole set and at least a flexible substrate having at least a pin terminal. At least an electronic device including an active component and a passive component is attached to the flexible substrate by adhesion. In the flexible substrate, electric signals of the electronic device are delivered to the pin terminal through at least a conductive wire for transmitting electric signals. In assembly, the pin terminal of the flexible substrate is inserted into the pin hole of the main substrate. Then, the flexible substrate is folded so as to package the electronic device in a three-dimensional multichip stack manner.
Bibliography:Application Number: US20040957653