Method of laser irradiation

A method of laser irradiation including reflecting a linear laser beam from a mirror to bend an optical path of the laser beam, adjusting a width of the laser beam in the short axis direction of the laser beam whose optical path is bent by the mirror, by a short axis homogenizer, and irradiating an...

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Bibliographic Details
Main Authors AWANO TAKASHI, MIZOUCHI KIYOTSUGU, MITSUHASHI HIROSHI
Format Patent
LanguageEnglish
Published 15.09.2005
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Summary:A method of laser irradiation including reflecting a linear laser beam from a mirror to bend an optical path of the laser beam, adjusting a width of the laser beam in the short axis direction of the laser beam whose optical path is bent by the mirror, by a short axis homogenizer, and irradiating an amorphous silicon semiconductor on a translucent substrate with the laser beam whose width in the short axis direction is adjusted by the short axis homogenizer, wherein the intensity of the laser beam is adjusted by adjusting the angle of the mirror.
Bibliography:Application Number: US20050054555