Active thermal control system with miniature liquid-cooled temperature control device for electronic device testing

A temperature control system, which includes a miniature liquid-cooled heat sink, is used to provide a controlled temperature surface to an electronic device, such as a semiconductor device, during the testing or bum-in phase. In one embodiment, the system includes a miniature liquid-cooled heat sin...

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Bibliographic Details
Main Authors BEYERLE RICK, KABBANI SAMER, BACHELDER DON
Format Patent
LanguageEnglish
Published 14.07.2005
Edition7
Subjects
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
TESTING
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Summary:A temperature control system, which includes a miniature liquid-cooled heat sink, is used to provide a controlled temperature surface to an electronic device, such as a semiconductor device, during the testing or bum-in phase. In one embodiment, the system includes a miniature liquid-cooled heat sink device having a monolithic counter-flowing structure. In other embodiments, the system includes a heater, a flow control valve, a controller, and/or sensors.
Bibliography:Application Number: US20040758209