Semiconductor device having metal plates and semiconductor chip

A semiconductor device includes: a semiconductor chip; a first metal plate disposed on one side of the chip through a first solder layer; a second metal plate disposed on the other side of the chip through a second solder layer; a third metal plate disposed on the second metal plate through a third...

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Bibliographic Details
Main Authors NAKASE YOSHIMI, SAKAMOTO YOSHITSUGU
Format Patent
LanguageEnglish
Published 05.05.2005
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor device includes: a semiconductor chip; a first metal plate disposed on one side of the chip through a first solder layer; a second metal plate disposed on the other side of the chip through a second solder layer; a third metal plate disposed on the second metal plate through a third solder layer; supporting means for holding at least one of distances between the chip and the first metal plate and between the chip and the second metal plate; and excess solder accommodation means for accommodating excess solder in a case where the third solder layer includes the excess solder.
Bibliography:Application Number: US20040972475