Stackable motherboard and related sensor systems

The stackable motherboard 10 of the first embodiment includes: a circuit board 12 having a first side 14 and a second side 16 opposite the first side 14, a processor 16 mounted on the circuit board 12, a first peripheral interconnect 18, and a second peripheral interconnect 20. The stackable motherb...

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Bibliographic Details
Main Author MCCUBBREY DAVID L
Format Patent
LanguageEnglish
Published 07.04.2005
Edition7
Subjects
CALCULATING
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PHYSICS
PRINTED CIRCUITS
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Summary:The stackable motherboard 10 of the first embodiment includes: a circuit board 12 having a first side 14 and a second side 16 opposite the first side 14, a processor 16 mounted on the circuit board 12, a first peripheral interconnect 18, and a second peripheral interconnect 20. The stackable motherboard 10 also preferably includes: a first motherboard interconnect 22 mounted on the first side 14 of the circuit board 12 and adapted to communicate data between the processor 16 and a first auxiliary motherboard, and a second motherboard interconnect 24 mounted on the second side 16 of the circuit board 12 and adapted to communicate data between the processor 16 and a second auxiliary motherboard.
Bibliography:Application Number: US20040998020