Compound coupling

A compound coupling for mounting a component (60) having a first coefficient of thermal expansion (CTE) to a base (62) having a second CTE, the compound coupling comprising a first flexure coupling (40), a second flexure coupling (40), and a third flexure coupling (40), each flexure coupling (40) ex...

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Bibliographic Details
Main Author BLANDING DOUGLASS L
Format Patent
LanguageEnglish
Published 31.03.2005
Edition7
Subjects
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Summary:A compound coupling for mounting a component (60) having a first coefficient of thermal expansion (CTE) to a base (62) having a second CTE, the compound coupling comprising a first flexure coupling (40), a second flexure coupling (40), and a third flexure coupling (40), each flexure coupling (40) extends from the base (62) to the component (60) and attached to the base (62) at a first and a second mount point (66, 68) associated with that flexure coupling (40). Each flexure coupling (40) is also attached to the component (60) at an associated component mount point (64). Each flexure coupling (40) has a flexure CTE substantially equal to the second CTE of base (62).
Bibliography:Application Number: US20030670439