Cleaning composition, method of cleaning semiconductor substrate, and method of forming wiring on semiconductor substrate

A cleaning composition comprises at least quaternary ammonium hydroxide, a water-soluble organic solvent, water, an anticorrosive, and potassium hydroxide of 1 mass percent or less of a total amount of the solution. This cleaning composition can singly and effectively remove a photoresist film, a bu...

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Main Authors HUSSEIN MAKAREM A, CLARK SHAN CHRISTOPHER, HARAGUCHI TAKAYUKI, JONG LANA I, YOKOI SHIGERU, WAKIYA KAZUMASA
Format Patent
LanguageEnglish
Published 23.12.2004
Edition7
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Summary:A cleaning composition comprises at least quaternary ammonium hydroxide, a water-soluble organic solvent, water, an anticorrosive, and potassium hydroxide of 1 mass percent or less of a total amount of the solution. This cleaning composition can singly and effectively remove a photoresist film, a buried material, a metallic residue from the surface of a semiconductor substrate.
Bibliography:Application Number: US20040864394