Cleaning composition, method of cleaning semiconductor substrate, and method of forming wiring on semiconductor substrate
A cleaning composition comprises at least quaternary ammonium hydroxide, a water-soluble organic solvent, water, an anticorrosive, and potassium hydroxide of 1 mass percent or less of a total amount of the solution. This cleaning composition can singly and effectively remove a photoresist film, a bu...
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Main Authors | , , , , , |
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Format | Patent |
Language | English |
Published |
23.12.2004
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Edition | 7 |
Subjects | |
Online Access | Get full text |
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Summary: | A cleaning composition comprises at least quaternary ammonium hydroxide, a water-soluble organic solvent, water, an anticorrosive, and potassium hydroxide of 1 mass percent or less of a total amount of the solution. This cleaning composition can singly and effectively remove a photoresist film, a buried material, a metallic residue from the surface of a semiconductor substrate. |
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Bibliography: | Application Number: US20040864394 |