Electronic pckage with conductive pad capable of withstanding significant loads and information handling system utilizing same

A circuitized substrate which utilizes an underlying conductive layer coupled to a pad on the substrate to assure a reinforced pad which will not be damaged or removed from the substrate when subjected to a significant load. Two or more pads can be similarly provided and coupled to the conductive la...

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Bibliographic Details
Main Author ALCOE DAVID J
Format Patent
LanguageEnglish
Published 02.12.2004
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:A circuitized substrate which utilizes an underlying conductive layer coupled to a pad on the substrate to assure a reinforced pad which will not be damaged or removed from the substrate when subjected to a significant load. Two or more pads can be similarly provided and coupled to the conductive layer, e.g., the layer being a common (ground) layer. An information handling system (e.g., a personal computer) utilizing the substrate is also provided.
Bibliography:Application Number: US20040868066