Ball grid array with bumps
A semiconductor chip assembly includes a chip carrier having a dielectric layer and electrically-conductive terminals in the form of projecting bumps formed integrally with traces on the dielectric layer. The bumps have convex surfaces and desirably are hollow and deformable. The convex bottom ends...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
11.11.2004
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Edition | 7 |
Subjects | |
Online Access | Get full text |
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