Ball grid array with bumps

A semiconductor chip assembly includes a chip carrier having a dielectric layer and electrically-conductive terminals in the form of projecting bumps formed integrally with traces on the dielectric layer. The bumps have convex surfaces and desirably are hollow and deformable. The convex bottom ends...

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Bibliographic Details
Main Authors HABA BELGACEM, KUBOTA YOICHI
Format Patent
LanguageEnglish
Published 11.11.2004
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor chip assembly includes a chip carrier having a dielectric layer and electrically-conductive terminals in the form of projecting bumps formed integrally with traces on the dielectric layer. The bumps have convex surfaces and desirably are hollow and deformable. The convex bottom ends of the bumps may be bonded to the contact pads on the surfaces of a circuit panel by a small amount of solder or other bonding material. The structure provides a sound joint between the contact pads and the bumps and avoids the need for relatively large solder balls. The assembly can be made using techniques well-integrated with conventional surface-mounting techniques.
Bibliography:Application Number: US20040786819