Semiconductor device, semiconductor device substrate, and manufacturing method thereof that can increase reliability in mounting a semiconductor element

A semiconductor device substrate includes a substrate body having a wiring layer. A base is formed by a material that is different from a material of the substrate body. The base supports the substrate body, and has an opening forming portion where a semiconductor element is mounted. A reinforcing m...

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Bibliographic Details
Main Authors ROKUGAWA AKIO, OOI KIYOSHI, YAMASAKI TOMOO, TAKANO AKIHITO
Format Patent
LanguageEnglish
Published 23.09.2004
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor device substrate includes a substrate body having a wiring layer. A base is formed by a material that is different from a material of the substrate body. The base supports the substrate body, and has an opening forming portion where a semiconductor element is mounted. A reinforcing member is larger than the opening forming portion, provided in the substrate body at a portion corresponding to the opening forming portion, and reinforces the substrate body at the portion corresponding to the opening forming portion.
Bibliography:Application Number: US20040800603