Low-profile electronic circuit module and method for manufacturing the same
A circuit board having lands provided on the top surface of the circuit board and the bottom surface of a recess formed in the top surface and a metal mask having a projection on the bottom surface thereof are prepared. Solder cream is applied to the lands using the metal mask. Then, chip components...
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Main Author | |
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Format | Patent |
Language | English |
Published |
23.09.2004
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Edition | 7 |
Subjects | |
Online Access | Get full text |
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Summary: | A circuit board having lands provided on the top surface of the circuit board and the bottom surface of a recess formed in the top surface and a metal mask having a projection on the bottom surface thereof are prepared. Solder cream is applied to the lands using the metal mask. Then, chip components and a flip chip IC are placed on the solder cream, and the circuit board is put into a reflow oven where the solder cream is melted and solidified so that external terminals of the chip components are reflow-soldered on the lands on the top surface of the circuit board and solder balls of the flip chip IC are reflow-soldered on the lands on the bottom surface of the recess. |
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Bibliography: | Application Number: US20040801317 |