Low-profile electronic circuit module and method for manufacturing the same

A circuit board having lands provided on the top surface of the circuit board and the bottom surface of a recess formed in the top surface and a metal mask having a projection on the bottom surface thereof are prepared. Solder cream is applied to the lands using the metal mask. Then, chip components...

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Bibliographic Details
Main Author HIROSE YOSHITAKA
Format Patent
LanguageEnglish
Published 23.09.2004
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:A circuit board having lands provided on the top surface of the circuit board and the bottom surface of a recess formed in the top surface and a metal mask having a projection on the bottom surface thereof are prepared. Solder cream is applied to the lands using the metal mask. Then, chip components and a flip chip IC are placed on the solder cream, and the circuit board is put into a reflow oven where the solder cream is melted and solidified so that external terminals of the chip components are reflow-soldered on the lands on the top surface of the circuit board and solder balls of the flip chip IC are reflow-soldered on the lands on the bottom surface of the recess.
Bibliography:Application Number: US20040801317