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Summary:One method of the present invention relates to a method for spray forming metal deposits. The method is comprised of providing a ceramic substrate having a spraying pattern for receiving sprayed metal particles, spraying metal particles onto the spraying pattern to form a metal deposit on the spraying pattern for at least a first spray period, controlling the spraying step during the first spray period so that the temperature of the deposited metal particles increases at an average rate of less than or equal to about 15° per minute. The first spray period can be defined as lasting until the temperature of the deposited metal particles is at or about a steady state temperature. The steady state temperature is preferably in the range of about 330° C. to about 370° C.
Bibliography:Application Number: US20030248692