OPTICAL COMPONENT PACKAGE
A process for forming a polyphenylene sulfide (PPS) component is disclosed. The PPS is molded at a temperature of about 110° C. to about 150° C. After molding, the PPS has a morphology that is at least fifty percent polycrystalline. The component is then annealed to further increase the polycrystall...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
01.07.2004
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Edition | 7 |
Subjects | |
Online Access | Get full text |
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Summary: | A process for forming a polyphenylene sulfide (PPS) component is disclosed. The PPS is molded at a temperature of about 110° C. to about 150° C. After molding, the PPS has a morphology that is at least fifty percent polycrystalline. The component is then annealed to further increase the polycrystalline portion of the PPS morphology. To effect this increase, the component is annealed at a temperature that is at least above the glass transition temperature of the molded PPS component but below its melting temperature. The component is used in optical applications and other applications in which alignment tolerances are small. |
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Bibliography: | Application Number: US20010814909 |