Qualifying patterns, patterning processes, or patterning apparatus in the fabrication of microlithographic patterns
Methods that include acquiring aerial images of a reticle for different values of a member of a set of lithographic variables are provided. One method also includes determining a presence of an anomaly in a design pattern of the reticle by comparing at least one pair of the aerial images correspondi...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
13.05.2004
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Edition | 7 |
Subjects | |
Online Access | Get full text |
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Summary: | Methods that include acquiring aerial images of a reticle for different values of a member of a set of lithographic variables are provided. One method also includes determining a presence of an anomaly in a design pattern of the reticle by comparing at least one pair of the aerial images corresponding to at least two of the different values. A different method includes comparing at least one pair of the aerial images corresponding to at least two of the different values and determining an area on the reticle where a lithography process using the reticle is most susceptible to failure based on the results of the comparison. Another embodiment includes determining a presence of transient repeating defects on the reticle by subtracting non-transient defects from the aerial images and comparing at least one pair of the aerial images corresponding to at least two of the different values. |
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Bibliography: | Application Number: US20030619943 |