Retaining ring for use on a carrier of a polishing apparatus

The invention provides a unitary retaining ring for use in a CMP apparatus. The retaining ring features a pad engaging surface which is designed to be flat and planar when the retaining ring is mounted to a carrier of the CMP apparatus. The pad engaging surface includes portions which surround the w...

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Bibliographic Details
Main Authors EASTER WILLIAM G, WILLIS GEORGE D
Format Patent
LanguageEnglish
Published 22.04.2004
Edition7
Subjects
DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
TRANSPORTING
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Summary:The invention provides a unitary retaining ring for use in a CMP apparatus. The retaining ring features a pad engaging surface which is designed to be flat and planar when the retaining ring is mounted to a carrier of the CMP apparatus. The pad engaging surface includes portions which surround the wafer and contact a pad and slurry on the CMP apparatus. A plurality of mounting features are provided along a carrier engaging surface of the ring. The mounting features are installed to cause localized compressive stresses in the material when in a demounted state. Upon mounting to a carrier of the CMP apparatus under specified torque or force conditions, tensile stresses are applied to the material of the ring resulting in a flat and planar mounted front surface.
Bibliography:Application Number: US20030684358