Packaging integrated circuits with adhesive posts

A package for an integrated circuit that is attached to a rigid substrate by the flip-chip method has a heat spreader that is attached to the IC by a thermally conductive, compliant adhesive and that is attached to the package substrate by a set of rigid posts of adhesive, the result of which is tha...

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Bibliographic Details
Main Authors BONITZ BARRY A, VINCENT MICHAEL B, JOHNSON ERIC A
Format Patent
LanguageEnglish
Published 22.04.2004
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A package for an integrated circuit that is attached to a rigid substrate by the flip-chip method has a heat spreader that is attached to the IC by a thermally conductive, compliant adhesive and that is attached to the package substrate by a set of rigid posts of adhesive, the result of which is that the heat spreader is more closely parallel to the substrate than was the case for a stiffener bonded to the substrate by a thin film extending over a large area.
Bibliography:Application Number: US20020278687