Controlled impedance for wire bonding interconnects

A die wire bonded to a semiconductor substrate includes insulated signal wire, insulated power wires and uninsulated ground wires between the die and the semiconductor substrate. A conductive material is provided over the signal, power and ground wire bonds which provides an electrical connection be...

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Bibliographic Details
Main Authors RANGANATHAN RAMASWAMY, THURAIRAJARATNAM ARITHARAN
Format Patent
LanguageEnglish
Published 15.04.2004
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A die wire bonded to a semiconductor substrate includes insulated signal wire, insulated power wires and uninsulated ground wires between the die and the semiconductor substrate. A conductive material is provided over the signal, power and ground wire bonds which provides an electrical connection between the uninsulated ground wires. The conductive material follows the same profile as the wire bonds and provides a controlled impedance environment for the signal wirebonds.
Bibliography:Application Number: US20020269586