Molded eddy current array probe

The present invention provides an eddy current array probe having a complaint body molded around a rigid insert. A flexible eddy current array circuit is wrapped around the outer surface of the compliant body.

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Bibliographic Details
Main Authors GRESHAM SANDIE ELIZABETH, MCKNIGHT WILLIAM STEWART, NATH SHRIDHAR CHAMPAKNATH, BATZINGER THOMAS JAMES, TRANTOW RICHARD LLOYD, ROSE CURTIS WAYNE, INGRAM DOUGLAS EDWARD, ERTEL JOHN WILLIAM, LITTLE FRANCIS HOWARD
Format Patent
LanguageEnglish
Published 25.03.2004
Edition7
Subjects
INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES
MEASURING
MEASURING ANGLES
MEASURING AREAS
MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS
PHYSICS
TESTING
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Summary:The present invention provides an eddy current array probe having a complaint body molded around a rigid insert. A flexible eddy current array circuit is wrapped around the outer surface of the compliant body.
Bibliography:Application Number: US20020253848