Ball grid array structures and tape-based method of manufacturing same

• Main Author: MORRISON MICHAEL W
• Format: Patent
• Language: English
• Published: 04.03.2004
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

Methods of packaging semiconductor dice in grid array-type semiconductor device packages using conventional lead frame or lead lock tape assembly equipment and semiconductor device packages formed in accordance with such methods. Circuitry-bearing segments having an electrically insulating layer that carries redistribution circuitry and redistributed bond pads and which is supported from beneath by a support layer are secured to the active surface of a semiconductor die. The support layer may comprise an electrically conductive material, which may act as a heat sink or as a ground plane for the packaged semiconductor device. The method provides increased accuracy with which segments are placed on a semiconductor die relative to the placement accuracies provided when pick-and-place equipment is used to position conventional grid array substrates relative to semiconductor dice.