Semiconductor device having a ball grid array and a fabrication process thereof

A semiconductor device has a resin package layer on a principal surface of a semiconductor chip, on which a number of bump electrodes are formed, wherein the semiconductor device has a chamfer surface or a stepped surface on a top edge part such that the external shock or stress applied to such an e...

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Bibliographic Details
Main Authors MATSUKI HIROHISA, FUKASAWA NORIO, NAGASHIGE KENICHI, MORIOKA MUNEHARU, HAMANAKA YUZO
Format Patent
LanguageEnglish
Published 22.01.2004
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor device has a resin package layer on a principal surface of a semiconductor chip, on which a number of bump electrodes are formed, wherein the semiconductor device has a chamfer surface or a stepped surface on a top edge part such that the external shock or stress applied to such an edge part is dissipated by the chamfer surface of the stepped surface.
Bibliography:Application Number: US20030618721