Semiconductor module and power conversion device

One method of achieving the above subjects is by connecting one of electroconductive members 12, which are pre-connected to the top and bottom of a semiconductor chip 11 and have thermal conductivity, to an electroconductive member 13, which is used with the semiconductor chip 11 to constitute a lam...

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Bibliographic Details
Main Authors OCHIAI YOSHITAKA, ANAN HIROMICHI, YOSHIZAKI ATSUHIRO, MASHINO KEIICHI
Format Patent
LanguageEnglish
Published 22.01.2004
Edition7
Subjects
APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC,OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWERSUPPLY SYSTEMS
BASIC ELECTRIC ELEMENTS
CONTROL OR REGULATION THEREOF
CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUTPOWER
CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
GENERATION
SEMICONDUCTOR DEVICES
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Summary:One method of achieving the above subjects is by connecting one of electroconductive members 12, which are pre-connected to the top and bottom of a semiconductor chip 11 and have thermal conductivity, to an electroconductive member 13, which is used with the semiconductor chip 11 to constitute a laminated structure, in electrically insulated form on the same surface as the installation surface of the electroconductive member 13 so as to straddle the laminated structure constituted by the semiconductor chip 11 and the electroconductive member 13.
Bibliography:Application Number: US20030610822