Method of forming tungsten-coated W-Cu composite powder and use of the same

Disclosed is a method of forming a W-Cu composite powder having a Cu particle surrounded by tungsten by mixing and pulverizing tungsten oxide powder and copper oxide powder using turbular mixing or ball milling, reducing the Cu powder firstly at 200~400° C. under a hydrogen atmosphere or a reducing...

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Bibliographic Details
Main Authors SONG HUNG-SUB, HONG MOON-HEE, KIM EUN-PYO, LEE SEONG, NOH JOON-WOONG, BAEK WOON-HYUNG
Format Patent
LanguageEnglish
Published 06.11.2003
Edition7
Subjects
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Summary:Disclosed is a method of forming a W-Cu composite powder having a Cu particle surrounded by tungsten by mixing and pulverizing tungsten oxide powder and copper oxide powder using turbular mixing or ball milling, reducing the Cu powder firstly at 200~400° C. under a hydrogen atmosphere or a reducing gas environment including hydrogen, generating W nuclei on the reduced Cu powder at 500~700° C., and growing the generated W nuclei at 750~1080° C. as well as a use of the same for the use of powder injection molding.
Bibliography:Application Number: US20030430067