Method of forming tungsten-coated W-Cu composite powder and use of the same
Disclosed is a method of forming a W-Cu composite powder having a Cu particle surrounded by tungsten by mixing and pulverizing tungsten oxide powder and copper oxide powder using turbular mixing or ball milling, reducing the Cu powder firstly at 200~400° C. under a hydrogen atmosphere or a reducing...
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Main Authors | , , , , , |
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Format | Patent |
Language | English |
Published |
06.11.2003
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Edition | 7 |
Subjects | |
Online Access | Get full text |
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Summary: | Disclosed is a method of forming a W-Cu composite powder having a Cu particle surrounded by tungsten by mixing and pulverizing tungsten oxide powder and copper oxide powder using turbular mixing or ball milling, reducing the Cu powder firstly at 200~400° C. under a hydrogen atmosphere or a reducing gas environment including hydrogen, generating W nuclei on the reduced Cu powder at 500~700° C., and growing the generated W nuclei at 750~1080° C. as well as a use of the same for the use of powder injection molding. |
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Bibliography: | Application Number: US20030430067 |