Robust leaded molded packages and methods for forming the same

A method for making a flip chip in a leaded molded package is disclosed. In some embodiments, the method includes using a leadframe structure including a die attach region and leads. The die attach region includes depressions proximate the inner portions of the leads, and an aperture in the die atta...

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Bibliographic Details
Main Authors GESTOLE MARVIN R, CABAHUG ELSIE AGDON, TUMULAK-RIOS MARGIE S, MANATAD ROMEL N, MONTAYRE LILITH U
Format Patent
LanguageEnglish
Published 16.10.2003
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A method for making a flip chip in a leaded molded package is disclosed. In some embodiments, the method includes using a leadframe structure including a die attach region and leads. The die attach region includes depressions proximate the inner portions of the leads, and an aperture in the die attach region. A semiconductor die is mounted to the die attach region. A molding material passes through the aperture and covers the first surface of the semiconductor die and the die attach region.
Bibliography:Application Number: US20030413668