Electrical device

In the case of an electrical device with a circuit arranged on a support plate and with a leadframe, forming electrical leads, for the electrical connection of the circuit to further electrical components, it is provided that the support plate is in heat-conducting connection with at least a part of...

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Bibliographic Details
Main Authors NITZSCHKE MICHAEL, DORRHOFER STEFAN, SCHULTZ DIETMAR
Format Patent
LanguageEnglish
Published 11.09.2003
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:In the case of an electrical device with a circuit arranged on a support plate and with a leadframe, forming electrical leads, for the electrical connection of the circuit to further electrical components, it is provided that the support plate is in heat-conducting connection with at least a part of the leadframe. In this case, the leadframe may be formed at least partly with a flat surface area and the support plate may rest on the flat part. An electrical insulation between the support plate and the leadframe may be formed by a double-sided adhesive film or by a printed-on adhesive.
Bibliography:Application Number: US20030345133