Method for manufacturing a semiconductor device, semiconductor device, display device, and electronic device

• Main Author: HIROSHIMA YASUSHI
• Format: Patent
• Language: English
• Published: 28.08.2003
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FREQUENCY-CHANGING; NON-LINEAR OPTICS; OPTICAL ANALOGUE/DIGITAL CONVERTERS; OPTICAL LOGIC ELEMENTS; OPTICS; PHYSICS; SEMICONDUCTOR DEVICES; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF

An insulating film (12) is formed on a substrate (11), and an aperture (121) is formed in the prescribed position on the surface of the insulating film (12) perpendicular to such surface, and an amorphous silicon film (13) having a prescribed thickness is formed on the insulating film (12). Subsequently, the amorphous silicon film (13) is changed to a polycrystalline silicon film (13) by a solid-phase growth through a heat treatment. The polycrystalline silicon film (13) is irradiated by a laser under a prescribed condition, and the polycrystalline silicon inside the bottom part of the aperture (121) is maintained in an unmelted state while other parts of the polycrystalline silicon film are completely melted, so that the unmelted polycrystalline silicon can be used as a crystal nucleus for crystal growth, and the area around the aperture (121) in the polycrystalline silicon film is changed to a silicon film in a substantially single crystal state. Using such silicon film in a substantially single crystal state, a thin-film transistor is obtained.