Low thermal resistance interface for attachment of thermal materials to a processor die

A heat sink comprises a side including a structural member defining a distance between a heat generating structure and the second side of the heat sink.

Saved in:
Bibliographic Details
Main Authors DISTEFANO ERIC, BHATIA RAKESH
Format Patent
LanguageEnglish
Published 03.07.2003
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

Abstract A heat sink comprises a side including a structural member defining a distance between a heat generating structure and the second side of the heat sink.
AbstractList A heat sink comprises a side including a structural member defining a distance between a heat generating structure and the second side of the heat sink.
Author BHATIA RAKESH
DISTEFANO ERIC
Author_xml – fullname: DISTEFANO ERIC
– fullname: BHATIA RAKESH
BookMark eNqNzL0KAjEQBOAUWvj3DgvWwl3S2IooFnYqlscSN1zgshuSBV_fFGJtNQPzMUszY2FamOdV3qAjlYQTFKqxKrIniKxUArYWpACqoh8TsYKEH0_YTMSpggog5CKeam38FWlt5qEttPnmymzPp_vxsqMsA9Xcnpl0eNxs17neOmv3h979pz6frzyp
ContentType Patent
DBID EVB
DatabaseName esp@cenet
DatabaseTitleList
Database_xml – sequence: 1
  dbid: EVB
  name: esp@cenet
  url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP
  sourceTypes: Open Access Repository
DeliveryMethod fulltext_linktorsrc
Discipline Medicine
Chemistry
Sciences
Edition 7
ExternalDocumentID US2003123228A1
GroupedDBID EVB
ID FETCH-epo_espacenet_US2003123228A13
IEDL.DBID EVB
IngestDate Fri Jul 19 16:40:22 EDT 2024
IsOpenAccess true
IsPeerReviewed false
IsScholarly false
Language English
LinkModel DirectLink
MergedId FETCHMERGED-epo_espacenet_US2003123228A13
Notes Application Number: US20030374963
OpenAccessLink https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20030703&DB=EPODOC&CC=US&NR=2003123228A1
ParticipantIDs epo_espacenet_US2003123228A1
PublicationCentury 2000
PublicationDate 20030703
PublicationDateYYYYMMDD 2003-07-03
PublicationDate_xml – month: 07
  year: 2003
  text: 20030703
  day: 03
PublicationDecade 2000
PublicationYear 2003
RelatedCompanies BHATIA RAKESH
DISTEFANO ERIC
RelatedCompanies_xml – name: BHATIA RAKESH
– name: DISTEFANO ERIC
Score 2.5755208
Snippet A heat sink comprises a side including a structural member defining a distance between a heat generating structure and the second side of the heat sink.
SourceID epo
SourceType Open Access Repository
SubjectTerms BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
Title Low thermal resistance interface for attachment of thermal materials to a processor die
URI https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20030703&DB=EPODOC&locale=&CC=US&NR=2003123228A1
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3dT8IwEL8QNOqbosYPNE00e1vcxmDjgRjZIMTIRwSUN9KyWyDBbYEa_n2v5UOeeGt6l6a99Hq_u_auAM8-VrDsCMv0rEpsusKvmhz9iSlQeIhoRy5XCc7tTqU1dN9H5VEO5ttcGF0ndKWLI5JGTUjfpT6vs_8gVqjfVi5fxIy60tfmoBYaW-9Y72AjrNcavW7YDYwgqA37RudT0xR6cPw38pWOCEh7Sh8aX3WVl5LtG5XmORz3aLxEXkAOkwKcBtu_1wpw0t5ceVNzo33LS_j-SFdMAbYfPmfkJivoRxSmSj4sYloGIwTKuJR8MlVBP5bGO3YCpuu9xmTKOMvW-QHEHs3wCp6ajUHQMmmG451AxsP-_nJK15BP0gRvgPklV9g89p3Is1xyfYRwbIxdS0S2wDiq3kLx0Eh3h8n3cKafsqngZqkIebn4xQcyyVI8akn-AT-Xkdc
link.rule.ids 230,309,783,888,25576,76876
linkProvider European Patent Office
linkToHtml http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3dT8IwEL8QNOKbosYP1CaavS3uCzYeFiMbBJWvCChvpN26SIIbgRr-fa_lQ554a3qXpr30er-79q4Ajx6v8LLFDN01KonuMK-qU-5FOuPM5ZybsUNlgnO7U2kOnbdReZSD6SYXRtUJXariiKhREeq7UOf17D-IFaq3lYsnNsGu7Lkx8ENt4x2rHayFNb_e64bdQAsCf9jXOh-KJtGD5b2gr3SAINuV-lD_rMm8lNmuUWmcwGEPx0vFKeR4WoRCsPl7rQhH7fWVNzbX2rc4g69WtiQSsP3QKUE3WUI_pBBZ8mGe4DIIIlBChaDRtwz6kSzZsiMwXe01IjJCyWyVH4Ds8YSfw0OjPgiaOs5wvBXIeNjfXY59Afk0S_klEM92mEkTz4pdw0HXhzHL5IljsNhkPImrV1DaN9L1fvI9FJqDdmvceu2838CxetYmA512CfJi_stv0TwLdqek-gdDSJTK
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=Low+thermal+resistance+interface+for+attachment+of+thermal+materials+to+a+processor+die&rft.inventor=DISTEFANO+ERIC&rft.inventor=BHATIA+RAKESH&rft.date=2003-07-03&rft.externalDBID=A1&rft.externalDocID=US2003123228A1