Low thermal resistance interface for attachment of thermal materials to a processor die

A heat sink comprises a side including a structural member defining a distance between a heat generating structure and the second side of the heat sink.

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Bibliographic Details
Main Authors DISTEFANO ERIC, BHATIA RAKESH
Format Patent
LanguageEnglish
Published 03.07.2003
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:A heat sink comprises a side including a structural member defining a distance between a heat generating structure and the second side of the heat sink.
Bibliography:Application Number: US20030374963