Semiconductor power device

• Main Authors: HIRANO NAOHIKO, NAKASE YOSHIMI, MIURA SHOJI, TESHIMA TAKANORI
• Format: Patent
• Language: English
• Published: 03.07.2003
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A semiconductor device includes a semiconductor chip, a first heat sink, a second heat sink, and a mold resin. The first heat sink is electrically and thermally connected to a surface of the semiconductor chip for functioning as an electrode for the semiconductor chip and releasing the heat generated by the semiconductor chip. The second heat sink is electrically and thermally connected to another surface of the semiconductor chip for functioning as another electrode for the semiconductor chip and releasing the heat. The semiconductor chip and the first and second heat sinks are covered with the mold resin such that the heat sinks are exposed on a substantially flat surface of the mold resin. The device is preferably cost-effective in the manufacturing and has preferable heat releasing capability because the means for insulating the heat sinks and releasing heat from the semiconductor chip become simple with the above structure.