Film vapor deposition method
There is provided a method of vapor depositing a film such that the film is not thermally damaged or broken by avoiding effects of heat and electrification of the film accompanied by the heating for melting, when a vapor deposition material is molten in vapor deposition preparation steps of the film...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
26.06.2003
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Edition | 7 |
Subjects | |
Online Access | Get full text |
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Abstract | There is provided a method of vapor depositing a film such that the film is not thermally damaged or broken by avoiding effects of heat and electrification of the film accompanied by the heating for melting, when a vapor deposition material is molten in vapor deposition preparation steps of the film, and a loss of the film can be decreased as compared with the conventional method, whereby the film can be moved and vapor-deposited stably. The film vapor deposition method is for forming a thin film on a long film 2 comprising aromatic polyamide in vacuum. During a material to be vapor-deposited is molten, the long film 2 is stood by or moved at a very low speed of 1 m/min or less under the condition that a shielding plate 9 between the material to be vapor-deposited and the long film 2 is closed. Once the material to be vapor-deposited is completely molten, the base film 2 is started to be moved substantially. At the same time or thereafter, the shielding plate 9 is open. |
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AbstractList | There is provided a method of vapor depositing a film such that the film is not thermally damaged or broken by avoiding effects of heat and electrification of the film accompanied by the heating for melting, when a vapor deposition material is molten in vapor deposition preparation steps of the film, and a loss of the film can be decreased as compared with the conventional method, whereby the film can be moved and vapor-deposited stably. The film vapor deposition method is for forming a thin film on a long film 2 comprising aromatic polyamide in vacuum. During a material to be vapor-deposited is molten, the long film 2 is stood by or moved at a very low speed of 1 m/min or less under the condition that a shielding plate 9 between the material to be vapor-deposited and the long film 2 is closed. Once the material to be vapor-deposited is completely molten, the base film 2 is started to be moved substantially. At the same time or thereafter, the shielding plate 9 is open. |
Author | KANAZAWA HIROMICHI NAKAYAMA MASAO |
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Snippet | There is provided a method of vapor depositing a film such that the film is not thermally damaged or broken by avoiding effects of heat and electrification of... |
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SubjectTerms | CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INFORMATION STORAGE INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY PHYSICS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
Title | Film vapor deposition method |
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