Structure of the metal bumping on the input/output connector of a substrate or wafer and method for manufacturing the same

• Main Authors: CHOU SHUIN, CHEN SHYUAN-FANG, CHIANG PANG-MING, LIN JYH-RONG
• Format: Patent
• Language: English
• Published: 12.06.2003
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A metal bumping structure on the input/output connector of a substrate or wafer, which is a metal conductor composed of multiple metal layers overlap the connector pad, characterized in that the overlapped outer or upper metal layer is thinner than the inner or lower metal layer, and the outer or upper metal layer that form the pillar style whose conductivity, connectivity and corrosion resist are better than the inner or lower metal layer, such that the bumping connector has better conductivity, connectivity and not easy to be corroded. It combines the photoresist, exposure, development with the electroless plating method to form the patterns and shapes of the expected object; wherein, the photoresist is to limit the deposition direction of the electroless, plating. If no limit on the electroless plating, it will cause isotropic deposition, as to simultaneously strive upward and around increasing; thus the photoresist is to assist with the electroless plating to form expected patterns and shapes.