Optoelectronic packaging assembly

Optoelectronic packaging assemblies for optically and electrically interfacing an electro-optical device to an optical fiber and to external circuitry. An optoelectronic packaging assembly includes a submount for holding an optical bench with an electro-optical device. Electrically conductive pins p...

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Bibliographic Details
Main Authors CRANE STANFORD W, HORVATH ZSOLT
Format Patent
LanguageEnglish
Published 06.03.2003
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
DEVICES USING STIMULATED EMISSION
ELECTRICITY
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PHYSICS
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Summary:Optoelectronic packaging assemblies for optically and electrically interfacing an electro-optical device to an optical fiber and to external circuitry. An optoelectronic packaging assembly includes a submount for holding an optical bench with an electro-optical device. Electrically conductive pins provide electrical contact to the electro-optical device. The optoelectronic packaging assembly includes an optical input receptacle for receiving an optical ferrule and an optical fiber. The optical input receptacle assists optical coupling of the electro-optical device to the optical fiber. The optoelectronic packaging assembly provides for cooling using a heat-sink or a thermal-electric-cooler. Beneficially, the optoelectronic packaging assembly is sealed using a cover.
Bibliography:Application Number: US20010940649