Co-cured joint with Z-pins
A method is provided for securing a three-dimensional woven preform to a first composite laminate component, the preform having a base and at least one leg extending from the base. The preform may be used to attach a second component or may be used alone to stiffen the first component. The preform a...
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Main Authors | , , , |
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Format | Patent |
Language | English |
Published |
06.03.2003
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Edition | 7 |
Subjects | |
Online Access | Get full text |
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Summary: | A method is provided for securing a three-dimensional woven preform to a first composite laminate component, the preform having a base and at least one leg extending from the base. The preform may be used to attach a second component or may be used alone to stiffen the first component. The preform and the first component are uncured, whereas the second component is cured prior to assembly. The preform is positioned on the first component, adhesive optionally being located between the preform and the first component. Z-pins are driven through the base of the preform and into the first component, the pins extending into the base and the first component. The second component is attached to the leg of the preform. A vacuum bag and tooling are used while curing the first component and the preform and the preform to the first component. The second component may be bonded or fastened to the preform. |
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Bibliography: | Application Number: US20010946627 |