Optical-electronic array module and method therefore

In one aspect of the invention, an assembly includes an optical-electronic die having electrically conductive pads and a submount with first and second opposing sides and a third side essentially perpendicular to the first submount side. The first and third submount sides have an adjoining edge, wit...

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Bibliographic Details
Main Authors KERRIGAN BRIAN MICHAEL, MALAGRINO GERALD DANIEL, BREZINA JOHNNY ROY
Format Patent
LanguageEnglish
Published 13.02.2003
Edition7
Subjects
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PHYSICS
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Summary:In one aspect of the invention, an assembly includes an optical-electronic die having electrically conductive pads and a submount with first and second opposing sides and a third side essentially perpendicular to the first submount side. The first and third submount sides have an adjoining edge, with electrically conductive pads on the first submount side bonded to the die pads, second electrically conductive pads on the third side of the submount, and electrically conductive traces interconnecting the first and second submount pads. The conductive traces are formed on the first and third sides and adjoining edge of the submount by a process that uses a shadow mask.
Bibliography:Application Number: US20010925593