Method of manufacturing member pattern and method of manufacturing wiring, circuit substrate, electron source, and image-forming apparatus

• Main Authors: UDA YOSHIMI, ISHIWATA KAZUYA
• Format: Patent
• Language: English
• Published: 06.02.2003
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS

A method of manufacturing wiring includes a step of forming a conductive layer pattern through a developing step after performing film formation and exposure step using photosensitive paste that contains a photosensitive material and a conductive material, a step of forming an insulating layer pattern through a developing step after performing film formation and exposure step using photosensitive paste that contains a photosensitive material and an insulating material, and a baking step for baking the conductive layer pattern and the insulating layer pattern. Thus, a wiring pattern can be formed with high precision by reducing an edge curl.