EMI shielding for semiconductor chip carriers

Electronic packages incorporating EMI shielding, and particularly semiconductor devices which incorporate semiconductor chip-carrier structures having grounded bands embedded therein which are adapted to reduce outgoing and incident EMI emissions for high-speed switching electronic packages.

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Bibliographic Details
Main Authors SABLINSKI WILLIAM EDWARD, PETERSON BRENDA LEE, STUTZMAN RANDALL JOSEPH, GAYNES MICHAEL ANTHONY, SPRING CHRISTOPHER TODD, SHANNON MEGAN J, ZITZ JEFFREY ALLEN, HAMEL HARVEY CHARLES, COFFIN JEFFREY THOMAS, ALCOE DAVID JAMES, WEISMAN RENEE L, INTERRANTE MARIO J
Format Patent
LanguageEnglish
Published 06.02.2003
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:Electronic packages incorporating EMI shielding, and particularly semiconductor devices which incorporate semiconductor chip-carrier structures having grounded bands embedded therein which are adapted to reduce outgoing and incident EMI emissions for high-speed switching electronic packages.
Bibliography:Application Number: US20010921062