Hole fill composition and method for filling holes in a substrate

A composition usable in hole filling of a metal layer and to planarize the metal layer is provided. The metal layer is part of a substrate which can be part of a multilayer printed circuit board or chip carrier. The composition comprises a fluoropolymer dielectric metal, a filler material, and a cou...

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Bibliographic Details
Main Authors FARQUHAR DONALD S, PAPATHOMAS KONSTANTINOS I
Format Patent
LanguageEnglish
Published 12.12.2002
Edition7
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
TECHNICAL SUBJECTS COVERED BY FORMER USPC
TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS
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Summary:A composition usable in hole filling of a metal layer and to planarize the metal layer is provided. The metal layer is part of a substrate which can be part of a multilayer printed circuit board or chip carrier. The composition comprises a fluoropolymer dielectric metal, a filler material, and a coupling agent, the filler material having at least a partial coating of the coupling agent thereon.
Bibliography:Application Number: US20010863961