Embossing and laminating irregular bonding patterns

• Main Authors: TANNER JAMES JAY, SCHULTZ WALTER T, PERKINS MARK D, BIGGS DAVID G, KRESSNER BERNHARDT E, RAYNOR WILLIAM J
• Format: Patent
• Language: English
• Published: 24.10.2002
• Edition: 7
• Subjects: MAKING ARTICLES OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNERANALOGOUS TO PAPER; MECHANICAL WORKING OR DEFORMATION OF PAPER, CARDBOARD ORMATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER; PERFORMING OPERATIONS; TRANSPORTING; WORKING PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUSTO PAPER

Webs can be embossed and laminated using irregular bonding patterns with the pin-on-pin embossing process. Different patterns are provided onto each web and the webs are joined in a bonding nip to form a laminate. The bonding pattern formed in the bonding nip is irregular. The irregularity of the bonding pattern reduces vibrations within the machinery and allows increased machine speed. The irregularity of the pattern can be determined using the Self-Similarity Count or the Energy Suppression Factor method.