Connecting device with local heating element and method for using same

A connecting device (13), such as for connecting an electronic component (10) to a heat sink (12), or connecting any two objects, includes a thermally activated adhesive (202a) with a local heating element (200) placed in contact therewith. The local heating element (200), such as a wire, may be emb...

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Bibliographic Details
Main Authors MC DUNN KEVIN J, ESTES KURT A
Format Patent
LanguageEnglish
Published 26.09.2002
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
TECHNICAL SUBJECTS COVERED BY FORMER USPC
TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
TRANSPORTING
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Summary:A connecting device (13), such as for connecting an electronic component (10) to a heat sink (12), or connecting any two objects, includes a thermally activated adhesive (202a) with a local heating element (200) placed in contact therewith. The local heating element (200), such as a wire, may be embedded within the thermally activated adhesive (202a), which may be in sheet form or non-sheet form. When the local heating element (200) is activated, the local heating element cures the adhesive (such as epoxy) within the thermally activated adhesive that is adjacent to the local heating element when, for example, current is passed through the local heating element (200).
Bibliography:Application Number: US20010812603